round type led lamps doc. no : qw0904-ldbk 12243-b01 rev. : a date : 19 - oct. - 2009 LDBK12243 data sheet ligitek electronics co.,ltd. property of ligitek only lead-free parts pb l dcc
note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 75% 100% 25% 25% 0 50% 75% 100% 50% -60 x directivity radiation -30 x 0 x 60 x 30 x 5.3 2.54typ 1.5max ?? 0.5 typ 1.0 4.0 ligitek electronics co.,ltd. property of ligitek only part no. LDBK12243 package dimensions 3.0 page 1/6 + - 25.0min 1.0min
luminous intensity @ ma(mcd) viewing angle 2 c 1/2 (deg) spectral halfwidth ??f nm wave length f nm color forward voltage @20ma(v) part no LDBK12243 note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. water clear emitted ingan/gan blue material lens 470 30 d typ. max. min. typ. 2700 3.5 4.0 14 4000 20 storage temperature electrostatic discharge( * ) operating temperature typical electrical & optical characteristics (ta=25 j ) dominant 500 -30 ~ +100 -20 ~ +80 tstg t opr esd j j v power dissipation forward current peak forward current duty 1/10@10khz reverse current @5v absolute maximum ratings at ta=25 j ratings dbk 100 50 120 30 i fp pd ir symbol parameter i f mw g a ma ma unit ligitek electronics co.,ltd. property of ligitek only 2/6 page * static electricity or power surge will damage the led. use of a c onductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. part no. LDBK12243
4/6 page dbk chip 1000 100 10 1 3.0 2.5 fig.1 forward current vs. forward voltage fig.2 relative intensity vs. forward current 1000 100 2.0 1.5 1.0 0.5 0.0 10 1 5.0 2.0 forward voltage(v) forward current(ma) forward current(ma) relative intensity normalize @20ma 3.0 1.2 fig.3 forward voltage vs. temperature 2.0 1.0 1.5 1.1 0.9 1.0 2.5 fig.4 relative intensity vs. temperature 40 80 100 60 0.0 20 40 60 80 100 -20 -40 0 0.8 -40 -20 0 ambient temperature( j ) ambient temperature( j ) 20 forward voltage@20ma normalize @25 j relative intensity@20ma normalize @25 j 0.5 0.5 550 500 400 0.0 450 wavelength (nm) relative intensity@20ma 1.0 0 1 4.0 3.0 1.0 ligitek electronics co.,ltd. property of ligitek only typical electro-optical characteristics curve fig.5 relative intensity vs. wavelength part no. LDBK12243
page 5/6 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 x c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 5 x /sec max temp( x c) 260x 260 x c3sec max 150 100 time(sec) 50 2 x /sec max 25x 0 0x preheat note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 120x dip soldering preheat: 120 x c max preheat time: 60seconds max ramp-up 2 x c/sec(max) ramp-down:-5 x c/sec(max) solder bath:260 x c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 60 seconds max part no. LDBK12243
reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 test item operating life test test condition reliability test: high temperature storage test 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) low temperature storage test 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) ligitek electronics co.,ltd. property of ligitek only this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. description mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 thermal shock test solder resistance test 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles solderability test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202:103b jis c 7021: b-11 high temperature high humidity test 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs the purpose of this test is the resistance of the device under tropical for hours. page 6/6 part no. LDBK12243
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